3D Glass Chips: India’s Semiconductor Push and Advanced Packaging Explained

1. Context

  • India has made a strategic entry into advanced semiconductor technology through 3D glass-based chip packaging, moving beyond basic assembly into a high-value, next-generation segment of the global chip value chain.
  • This is positioned as a key technological leap for applications like AI, telecom, and data centres.
3D Glass Chips
3D Glass Chips
PYQ – 2018, Ans – D

2. 3D Glass Chip vs Traditional Chip

  • Traditional (2D chips): Horizontal layout on silicon → limits scaling, higher heat, slower data transfer.
  • 3D glass chips: Vertical stacking using glass substrates → faster, energy-efficient, better heat management, higher density.
  • Key shift: 2D planar → 3D integrated architecture.

3. India’s Semiconductor Mission

  • The India Semiconductor Mission was approved in 2021 under the Semicon India Programme.
  • Outlay: ₹76,000 crore (initial), with expansion in later phases.
  • Objectives:
    • Reduce import dependence
    • Build a self-reliant semiconductor ecosystem
    • Position India in global supply chains
  • Focus Areas:
    • Fabrication (fabs)
    • ATMP (assembly, testing, packaging)
    • Chip design and R&D
    • Advanced packaging (like 3D glass technology)
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